Requiring no formal training or complicated setup, the quick and simple Handy Wafer Scriber is ideal for both educational and commercial research to easily scribe a variety of wafer materials up to 3 inches in diameter.。

 

 

Features

• Suitable for scribing InP, Glass, GaAs, Si, SiO2, Sapphire and SiC wafers up to 3 inches in diameter
• Predetermined scribing angle for optimal results
• Select tool. Secure wafer and scribe
• Two-part design with non-slip surface holds wafers firmly while scribing
• Unique pen design enables uniform scribing pressure

 

Other company’s product comparison table

 

Company Name	Tecdia	Company A	Company B
Product	Handy Wafer Scribe Kit	Hand Scriber	Diamond Scribe Pen
Application	Wafer Scribing	Wafer Scribing	Engraving (Dot Engraving, Line Engraving), Line Drawing
Cut Point Types	3-point, 4-point	3-point	N/A
Material	Glass, Sapphire GaAs, InP wafer, etc.	Sapphire, GaAs, Semiconductors, nanotech materials, etc.	Glass, Ceramics, etc.
Method of Holding Wafer in Place	Fixed with transparent plate	Uses another device	Uses another device
Cut Position Visibility	Good Visibility	Depends on auxiliary equipment	Depends on auxiliary equipment
Cut Point Setting	Automatic	Manual	No Settings Required
Scribe Angle Setting	Automatic	Manual	Manual
Load Control	Automatic	Manual	Manual
Scribing Straight Lines	Plate assists	Uses another device	Uses another Device
Price	$$$	$$	$

 

Handy Wafer Scriber (P/N: TEC-2000MS)

 

 

Related Sites

 

Case Study (Hand Scribing)