Features

• We manufacture capacitors and custom substrates
• In-house jig design and manufacturing
• Parts procurement agent
• Operation in English and Japanese
• Support from process start-up to mass production

Available equipment

• Manual Pin Set Bonder
• Automatic Wire Bonder
• Manual Wire Bonders (Wedge, Ball)
• Cap Sealing Equipment
• Laser Marking Equipment
• Bubble Leak Detector
• Helium Leak Detector
• Helium Pressurizer
• PIND Tester
• Thermal Shock Testing Equipment
• YAG Self-Aligning Welder
• Dispensing Equipment
• Wire Pull and Die Shear Strength Testers
• LD Die Bonder (Semi-Automatic)
• And More

Application Examples

Products for microwave communications

Die Bonding – Epoxy Bonding (Conductive / Non Conductive) – Eutectic Bonding – Wire Bonding – Au wire (Ball Wedge) – Au Ribbon – Soldering

Products for optical communication

– Die Bonding – Epoxy Bonding (Conductive/ Non Conductive) – Eutectic Bonding – Wire Bonding – Soldering – Resistance Welding – Lid Sealing – Cap Sealing – YAG Welding – He Leak Test – Alignment (Active Alignment method)