| Exhibition at the 2014 ECOC | (September 22-24, 2014) Tecdia will exhibit at the 2014 ECOC (European Conference on Optical Communications) held in the Palais des Festivals Convention Center located in Cannes, France (Booth 502). This year we will showcase developments in our new HCT (Hybrid Ceramic Technologies) substrate line along with our well known Single Layer Chip Capacitors. Please come by and visit! |
| New Product : Zirconium Nozzles | (July 22, 2014) Zirconium Nozzles nozzle has been added to the Precision Machined products line. |
| Tecdia Introduces New Handy Wafer Scriber Section on Website | Handy Wafer Scriber has been added to our Solutions section. |
| Tecdia Inc. (US) Relocated | Our Tecdia Inc. (US) office was relocated to Campbell, CA – about 10 miles south of our previous Santa Clara office. |
| TECDIA, Co. LTD. (KOREA) Relocated | TECDIA Co., Ltd. KOREA has moved to a new location at #704, 303 Hyowon-ro, Paldal-gu Suwon, Gyeonggi-do, Korea 442-835. |
| Tecdia Exhibits at 2014 MTTS International Microwave Symposium | Tecdia exhibited at the 2014 MTTS International Microwave Symposium held in the Tampa Convention Center located in Tampa Bay, Florida (Booth 1818) June 3rd thorough 5th. We showcased our new Hybrid Ceramic Technologies (HCT), Single Layer Chip Capacitors and other microwave products. |
| Tecida Adds CMI (Cebu Microelectronics Inc.) Video to Website | The introduction video for CMI (Cebu Microelectronics Inc.) has been added to the “Contract Manufacturing Service (CMS)” page. |
| “Conflict Mineral Policy” Added to Corporate Policies Page | “Conflict Mineral Policy” has been added to Corporate Policies under the “About Us” page. |
| Tecdia Exhibits at 14th Annual Fiver Optics Expo (FOE2014) in Japan | Tecdia exhibited at the 14th Annual Fiber Optics Expo (FOE2014) at Tokyo Big Sight in Japan. We showcased contract manufacturing of 100G coherent module devices, brand new ceramic and thin film technologies code named Hybrid Ceramic Technology as well as our Single Layer Ceramic Chip Capacitors on April 16th through 18th. |
| Tecdia Exhibits at 2014 Electronic Design Innovation Conference in China | Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2014) in Beijing, China at booth #611. We showcased Single Layer Ceramic Chip Capacitors, “ALTAS” Ultra Hi-K products, Broadband High Current Bias-T’s, and DC Power Boards for FET protection on April 8th through 10th. |
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