Latest News

Tecdia Exhibits at Atem Fair 2014

Tecdia exhibited at the ATEM FAIR 2014, the Adhesive, Coating and Film System Fair at Songdo CONVENSIA, Incheon. We showcased our products based on precision machine and diamond process technologies at booth #G119 on March 19th through 21st.
http://www.atemfair.com/?doc=eng_main.php&md=english

Tecdia Exhibits OFC/NFOEC Show

Tecdia exhibited at the 2014 OFC/NFOEC show in San Francisco, CA. This year showcased the latest in high performance Lightwave submount design with exotic patterning and 3D shapes on March 11th through 13th.
http://www.ofcconference.org/home

Tecdia Releases New Webpage Highlighting Ceramic Substrate Line

Tecdia is proud to release a new webpage with details regarding our new high performance ceramic substrate line, code named HCT. HCT offers engineers unparalleled design flexibility and extremely tight tolerances. Please visit the below website for details.

Tecdia Exhibitsat the 2014 MD&M

Tecdia exhibited at the 2014 MD&M West in Anaheim, CA at booth 919. We showcased our Dispensing Nozzle product line, Diamond Indenter, and diamond/Ti process technologies on February 11th through 13th.

Tecdia Exhibits at 43rd Internepcon Japan

Tecdia exhibited at 43rd INTERNEPCON JAPAN at Tokyo Big Sight. We showcased our Diamond Industrial Products, Precision Machined Products and Contract Manufacturing service at the East Hall booth # 41-15 on January 15th through 17th.
http://www.nepcon.jp/en/

“Diamond Indenter” page has been added to the Diamond Industrial Products line.
http://www.tecdia.com/us/products/diamond/diamondindenter.php

Tecdia exhibited at the Microwave Workshops & Exhibition (MWE 2013) being held at the Pacifico Yokohama in Kanagawa, Japan at booth C601. We will showcase our brand new ceramic thin film technology along with Single Layer Capacitors, Wide-Band/High-Voltage Bias-Ts, DC Power Boards, and Contract Manufacturing Services on November 27th through 29th.
http://apmc-mwe.org/mwe2013/index_e.html

Cebu Microelectronics Inc (CMI)- Tecdia’s fully owned contract facility located in the Philippines has remained intact following the devastating Haiyan Typhoon. We are fortunate to report our employees and facility are safe and operations are normal.

To meet growing business and to further improve our customer service, Tecdia Taiwan office has been relocated from Tao Yuan City to New Taipei City.
http://www.tecdia.com/us/company/global.php#04

An instructional video has been added to the “Handy Wafer Scriber” page.
http://www.tecdia.com/us/products/diamond/handscriber.php

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